-Applicable scenarios ： There are many boxes, shells, valve blocks, and side holes that require Four sided division The components; Suitable for stable production in medium to large quantities.

- Our Advantages

Four axis indexing: One clamping achieves multi side processing, with better consistency in hole spacing/position.

Stacking fixtures/palletization: In conjunction with the fixture system, Stable rhythm ， Beneficial for scalability.

- Ability and Indicators (Typical)

trip: 1000×1000×800 mm Level, maximum coverage up to 1600×800 mm Structural components of the work domain (evaluated by project fixtures).

Accuracy: Conventional ±0.01 mm ； Position accuracy of key hole system according to ±0.01–0.02 mm Control (drawing priority).

- Machinable Materials (excerpt)

Carbon/Alloy Steel: 45 #, 35 # Q235、40Cr、65Mn

Tool/Mold Steel: D2、Cr12/Cr12MoV、DC53、SKD6(A2)、P20、718、NAK80、8407(H13)、T10/T12、ASP-23、H136/S136

stainless steel: 0Cr18Ni(≈304)、SUS304、17-4PH Wait; Cast iron HT150 ； Copper/brass; POM/PEEK/PA and other engineering plastics

- post-processing

Heat treatment: Quenching and tempering, carburizing, nitriding, induction hardening, aging

Surface: Anodizing (natural color/hard coat/black), blackening, galvanizing/nickel plating, sandblasting/bead spraying QPQ wait

- Quality and documentation

Constant temperature testing room+ CMM three coordinate system ； Three inspections of incoming materials, process, and shipment

Can provide: Size/CMM report, material/heat treatment/surface report, COC certificate of conformity

Packing: VCI rust prevention+independent label+export wooden box ； support FOB/CIF/DAP/DDP, NDA confidentiality

- Quick Request for Quotation (RFQ) List

- 2D image (PDF/DWG)+3D model (STEP/IGS)

- Material, heat treatment, surface treatment standards

- Key Dimensions/Tolerances and Inspection Levels (FAI/CMM)

- Batch/rhythm and target delivery time; trade terms

- If it is an old part: sample photo/size/functional description (reverse mapping can be done)

highlight

- Dimensional accuracy: ±0.01 mm (At room temperature)

- Multi sided integrated processing, stable rhythm, smooth chip removal

- Applicable objects: brackets/bases, diversion blocks, surface structural components